To meet market demands for more camera module capabilities, a smaller form factor and uniformity across devices, manufacturers are challenged to optimize camera design and manufacturing efficiency without sacrificing quality.

Many electronic devices, including digital cameras, incorporate image sensors. Tessera's SHELLCASE^® wafer-level chip scale packaging (CSP) technology makes it possible to create image sensor packaging solutions that are thinner, more reliable and less expensive. The end result is improved device functionality and increased board capacity, enabling the next generation of smaller, smarter, faster electronic devices.

SHELLCASE MVP

The latest generation of Tessera's wafer-level CSP technology is the SHELLCASE MVP solution, which provides OEMs and camera module manufacturers with the benefits of reduced costs and accelerated time-to-market, without the need for modification or redesign of the image sensor wafer.

The SHELLCASE MVP solution is one of the industry's first available through silicon via (TSV) technologies. It is a break-through in image sensor packaging, utilizing a polymeric passivation and glass-silicon sandwich structure to enable image-sensing capabilities through the actual packaging structure.